Advanced Micro Devices Inc. et al v. Samsung Electronics Co Ltd et al

Filing 302

SEALING ORDER (Manning's office shall submit a chambers copy of it's 2/4/10 letter.) (tf, COURT STAFF) (Filed on 2/8/2010)

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William H. Manning (pro hac vice) E-mail: [e-mail] Brad P. Engdahl (pro hac vice) E-mail: [e-mail] Aaron R. Fahrenkrog (pro hac vice) E-mail: [e-mail] Robins, Kaplan, Miller & Ciresi L.L.P. 2800 LaSalle Plaza 800 LaSalle Avenue Minneapolis, MN 55402 Telephone: [phone] Facsimile: 612-339-4181 John P. Bovich (Bar No. 150688) E-mail: [e-mail] Reed Smith LLP 101 Second Street, Suite 1800 San Francisco, CA 94105 Telephone: [phone]

Robert T. Haslam (Bar No. 71134) E-mail: [e-mail] Covington & Burling LLP 333 Twin Dolphin Drive, Suite 700 Redwood Shores, CA 94065 Telephone: [phone] Facsimile: 650-632-4800 Christine Saunders Haskett (Bar No. 188053) E-mail: [e-mail] Covington & Burling LLP One Front Street San Francisco, CA 94111 Telephone: [phone] Facsimile: 415-591-6091 Alan H. Blankenheimer (Bar. No. 218713) E-mail: [e-mail] Christopher J. Longman (Bar. No. 234473) E-mail: [e-mail] Covington & Burling LLP 9191 Towne Centre Drive, 6th Floor San Diego, CA 92122 Telephone: [phone] Facsimile: 858-678-1601 Attorneys for Defendants and Counterclaimants Samsung Electronics Co., Ltd., et al.

Attorneys for Plaintiffs and Counterdefendants Advanced Micro Devices, Inc., et al.

UNITED STATES DISTRICT COURT NORTHERN DISTRICT OF CALIFORNIA SAN FRANCISCO DIVISION ADVANCED MICRO DEVICES, INC., et al., Plaintiffs, v. [Civil L.R. 7-12] SAMSUNG ELECTRONICS CO., LTD., et al., Defendants. Case. No. CV-08-0986-SI STIPULATION AND [PROPOSED] ORDER PERMITTING PROTECTED MATERIAL TO BE FILED UNDER SEAL

Advanced Micro Devices, Inc. and ATI Technologies, ULC (collectively, "AMD"), and Samsung Electronics Co., Ltd.; Samsung Semiconductor, Inc.; Samsung Austin Semiconductor,
Case No. CV-08-0986-SI STIP. AND [PROPOSED] ORDER RE FILING PROTECTED MATERIAL UNDER SEAL

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LLC; Samsung Electronics America, Inc.; Samsung Telecommunications America, LLC; and Samsung Digital Imaging Co., Ltd. (collectively, "Samsung") jointly submit this Stipulation regarding the filing of Protected Material under seal. WHEREAS, The Joint Stipulated Protective Order states that "a Party may not file in the public record in this action any Protected Material or document summarizing, discussing or otherwise referencing Protected Material." (Dkt. #60 at 12.) WHEREAS, AMD represents that AMD's letter regarding the admissibility of certain documents created by ARM Limited contains material from documents that Samsung has designated as Highly Confidential Protected Material. Pursuant to Civil Local Rule 7-12, IT IS HEREBY STIPULATED AND AGREED, by and between AMD and Samsung that, subject to the Court's approval, 1. AMD's letter regarding the admissibility of certain documents created by ARM

Limited shall be filed under seal, and a version of the letter with the confidential information redacted shall be filed publicly with the Court. DATED: February 4, 2010 ROBINS, KAPLAN, MILLER & CIRESI L.L.P. By: _/s/ Aaron R. Fahrenkrog_____ William H. Manning Aaron R. Fahrenkrog

ATTORNEYS FOR PLAINTIFFS ADVANCED MICRO DEVICES, INC. AND ATI TECHNOLOGIES ULC

Case No. CV-08-0986-SI

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STIP. AND [PROPOSED] ORDER RE FILING PROTECTED MATERIAL UNDER SEAL

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DATED: February 4, 2010

COVINGTON & BURLING LLP By: ___________________________________ Robert T. Haslam Alan H. Blankenheimer Christine Saunders Haskett Christopher J. Longman ATTORNEYS FOR SAMSUNG ELECTRONICS CO., LTD.; SAMSUNG SEMICONDUCTOR, INC.; SAMSUNG AUSTIN SEMICONDUCTOR, LLC; SAMSUNG ELECTRONICS AMERICA, INC.; SAMSUNG TELECOMMUNICATIONS AMERICA, LLC; AND SAMSUNG DIGITAL IMAGING CO., LTD.

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Case No. CV-08-0986-SI

Plaintiffs' counsel attests that concurrence in the filing of this document has been obtained from the above-named signatory.
PURSUANT TO STIPULATION, IT IS SO ORDERED.

February __, 2010

________________________________________ Honorable Susan Illston United States District Judge

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STIP. AND [PROPOSED] ORDER RE FILING PROTECTED MATERIAL UNDER SEAL