Google Inc. v. Netlist, Inc.

Filing 158

EXHIBITS B, C, E, L, Q, BB, C in Support re 157 Document E-Filed Under Seal to the Declaration of Scott T. Weingaertner filed by Google Inc.. (Attachments: # 1 Exhibit C, # 2 Exhibit E, # 3 Exhibit L, # 4 Exhibit Q, # 5 Exhibit BB, # 6 Exhibit CC)(Related document(s) 157 ) (Ezgar, Geoffrey) (Filed on 6/30/2010) Modified on 7/1/2010 (jlm, COURT STAFF).

Google Inc. v. Netlist, Inc.

Doc. 158 Att. 3

Dockets.Justia.com

T

Minutes of Meeting No. 15 JC-.45 Module Committee ,Jiine 6-7 P007
Members Present
Mien Quddus,

Seattle. WA
Corn oanx

Teleuhnne
[phone]

maa
mquddusssLsamsung,com
[e-mail]
mlchaei.ktt@amd .com joe .macrl@arnd .com

Chaimian
Marl< Kellogg,

Samsung Semiconductor

KCD Seivices [phone] Secretary Advanced Micro Devices Inc. [phone] Michael Litt Joseph Macti Advanced Micro Devices Inc. [phone] Advanced Micro Devices Inc. [phone] Sam Patel Agllent Technologies Perry Keller [phone] 408.544-7810 Manoj Roge Altera Corporation AlP Electronics Inc. [phone] Louis Lau Kazuyoshi Tsukada Buffalo Inc. 81-52-619-1695 bm Lan dgraf Cisco Systems Inc. 408-527-7544 510-440-1084 Charles Furnweger Consultant (71e) 726-4815 Cray Inc. Alan Grossmeler CST Inc 972-241-2662 Kit Chan (972) 241 -2862 CST Inc Cecil Ho Bill Sauber Dell Inc. 512 728 7970 Diablo Technologies Inc. Jim Mathias 408-566-5521 Elpida Memory incorporated 81-42-775-7329 Atsuo Koshizuka Elpida Memory Incorporated 81-42-775-7355 Takao Ono Eipida Memory incorporated 81 -42-775-7338 boshlo Suganc Freesoals Semiconductor [phone] Mark Farley [phone] Raj<esh Chal Freescate Semiconductor Google Inc. 650-253-0631 Robeñ Sprinkle GratTech International 21 6-529-3761 John Schober GSI Technology [phone] David Chapman Bela! Gharabeh Hewlett Packard Company 281-518-5263 HynIx Semiconductor 82-31-630-5573 Yongshln Kirn Hynlx Semiconductor DanIel Lee 82-31-630-2146 IBM Corporation 919-543-1964 Jim Foster IBM Corporation 914-945-2218 Kyu-hyoun Kirn Integrated Device 408-284-1452 Ramzi Ammar Technology Inc. Integrated Device Jiaylng Hou 408-574-0911 Technology Inc. Integrated Device Stanley Hronlk [phone] Technology Inc. Integrated Device 408-284-6528 bomdio Nana Technology Inc. Intet Corporation 253-371-7178 KuIjit Bains Intel Corporation Christopher Cog 916-358-3085 503-712-9626 Intel Corporation Howard David Intel Corporation Joseph Tsang 916-356-4195 Kingston Technology Mark Cheng [phone] Company Inc. James Clayton MAT 919.314-5520 MAT 919-314-5520 Zak Fathi Scott Graham Micron Technology Inc. 208-366-3960 [phone] Micron Technology Inc. George Pax Molex Inc. 630 527 4037 Jim McGrath 5124021011 Montage Technology Desi Rhoden 408-200-5620 Montalvo Systems Inc. Jay Gupta Mosel Viteuc Corporation Fred Jones [phone]

sam.pateItamd.com perry_keller©agilent.00m mroge©altera.com
[e-mail] [e-mail]

tklandccisco.com

charlescaf org
[e-mail] [e-mail] [e-mail]

bllLsauberdeII.ocm
[e-mail] koshizuka-atsuo©elplda.00m

ono-takaotelpida.com sugano4oshioçelpida .com
mark.farley©freescale.00m [e-mail] [e-mail]
[e-mail]

dchapmangsitechnology.com belal.gharaibehhp.com yongsI1nkimhynix.com

hk.Iee©hynix,com
[e-mail] [e-mail]

ramzi.ammarcidt.com

¡iaying.hcuidl.com
stanIey.hronlkidt.com

tomdio.nanaidt.com
[e-mail] christopher.e.co x©tnle I .com [e-mail] joseph.tsang©inteLoom
marl<_cheng©klngston.corn

jcIaytonmtcroassemblytech.com
zakfatPMn oir .com [e-mail] [e-mail] Jim. mcgrathmo lex, corn
desi@brite-su n. corn

jgupta©montalvosystems.m
[e-mail]

070371:mwk:07102107

Page 1 of 55

Exhibit 2
Solomon
8/13/0 9
Kae Gemanot, CSR #5342

GNETOB1751

Minutes of Meeting No. 15 J C-45 Modtße Committee
June 6-7V 2006
Jed Yang

Seattle, WA
408-961 -4012

Nanya Technology Corporation
Nethst Inc.

jedy©us. nanya.com [e-mail] [e-mail] nlc.roozeboom@r,xp. com

Mario Martinez DC Chal Nia Roozeboom Rocio! Salters Chrìstolller Suçai David Chan Jeffrey Chung Oliver kieIil William Shen Jang Seok Choi Jung-Joan Lee Howard Sussman Joe Froriewsid Mark Sikkink
Kelvin Marino Arthur Samio

Paul Goodwin Brian Miller
Doug Firt4<e

Nvldia Corporation NXP Semiconductors NXP Semiconductors PNV Technologies Inc. Qimonda Qlmonda Qimonda Qlmonda Samsung Semiconductor Samsung Semiconductor Sanyo Semiconductor Corporation Silego Technology Silicon Graphics Inc. Smart Modular Technologies, Inc. Smart Modular Technologies, Inc. Staktek Corporation Stakiek Corporation STEC

949-679-0159 408.486-7325 408-474-7655

3i 402742182
[phone] 408 501 5284 802.764-6764 802.764-1959 406-501-5804

roeIotsaltersnxp.com
[e-mail]

david.chanqimonda.com jeffmy.ohungqImonda.com ohverkiehl©qimonda.com
willia m.shen©qlmonda .com [e-mail] ju ngjaonseo. samsung .com

6241-208-6376 82-31-208-6678
[phone]

sanyo.hs©ix.netcom.com

408-327-8817 715-726-7424
[phone] [phone]
512-454-9531 512-454-9531 949-260-8246 [phone] 503-627-303 5 19-Bl 61-80-4665

joef©silego.com
mrslk@sgLcom

[e-mail]
arthur, [e-mail]

[e-mail] [e-mail]
dfl nke © st e o-inc. cem

Clement Fang Wiiton Hart IngoIf Frank Harald Parzhuber Sieve Millard Kim Whitman Craig Soldat Phan Hoang Rich Chiu John Schrrâtz Cecil Conkle

Sun Microsystems Inc. Tektronix Texas Instruments Inc. 49-8161-804038 Texas Instruments Inc. Tyco Electronics Corporation 717-986-5378 Tyco Electronics Corporation 717-592-3376 [phone] Verigy Inc. [phone] Virtium Technology Inc. Xillnx Inc. 408.879-4972 Xiilnx Inc. 408-879-7726 ZMOS Technology Inc. 408-750-1620

[e-mail] [e-mail] [e-mail] [e-mail] stave. rniilard©tycoelectronlcs.com [e-mail] craig.soldat©verigy.com [e-mail] [e-mail] [e-mail] [e-mail]

Qihnyn Pvesnnt Ai Lee Kuan John Cheng Paul Snell
Emmie Wang Masayuld Nakamura Masahiro Yaniaguchi Lidia Warnes Siamak Tavallasi

TeIpnhnri
Agilent Technologies

-mait

AIF electronics

Corsair Memory Elite Semiconductor Memory 886-3-5781 970 Tech.

ai-ieej<uan @agile n t . co m 6046808459 4087325875 [e-mail]. 00m 510-657-8747 x280 pa uis@ corsalrTn e mory. co m

[e-mail]
nakamura [e-mail]

Elpida Memory Inc.

[phone]

Elplda Memory Incorporated 81-42-775-7338
Hewlett-Packard Hewlett-Packard Company
916-748-2397 281.514-8453 408-232-8370 82-31 -630-5657

[e-mail]

Young Choul Im
Minho Kim Jeff Ryu Jonathan Hinicle
Kevin Liu

Hjnix
Hynix Semiconductor Hynix semiconductor IBM Corporation InCOMM Technologies Co. Ltd.

lidia.warnes©hp.00m [e-mail] ycklm©us.hynix.com [e-mail]

52-il-685-4651
919-254-18eS 888-3-6663693#6369

hycseog.ryuhynix.com
[e-mail]
kwl u 1incomm.com .tw

Page 2of 55

0NET081152

Minutes of Meeting No. 15 JC-45 Module Committee
,June 6-7. 2006
James Mccall Tensay Woldeyes Warren Morrow Clara Lim Jim Mathlos Jim Cooke Kevin Ryan
Robert Jin Lee Khem Bill Franciscovich Jeffrey Johnson
Pony Nm

Seattle. WA
503-264-6831 916-356-7873

Intel Intel

Intel Corporation LSI Logic Corporaffon Matilios Associates Ncron Technology (no. Micron Technology Inc. Montage Technology (Shanghaiì Co. L Montage Technology

253471-8836 408-433-4115
408-996-1521 208-568-1649

james.a.mccall@inteLcom [e-mail] w. r.niorrow@intehcom
clara .Ilm cIs I. corn

jniathios©yahoo.com

jcocke©microntom
kryan©micron,com

(208) 368-39M
408-982-2786
4089822787

[e-mail]
lee.kbem @montage-Lech.com

(Shanial) Co. L
Montage Technology Inc.
Nanya

831-594-7328 713-774-4113 886-3-3256225
x61 50

[e-mail] jeffjchnson©tx.nanya.com

Nanya Technology Co. Nanya Technology Corporation
Netl Ist

[e-mail]
[e-mail]

Joseph Ku

650-283-8170

Hyiin Lee Jeff Solomon Brian Daellenbach Michael Richter
Masashi Umino

Sung-Joe Park Rickl Williams Gerd Rombach Oavid Fast Bill Gervasi
Chienti Hou

Netlist Northwest Logic Qlmonda Renesas Technology Corporation Samsung Electronics Sun Microsystems Inc. Texas Instruments Tyco electronics US Modular

949-648-0541 [e-mail] 949-679-0157 [e-mail] 503-533-5800 x309 briand©nwlogl o. corn michael. richter©qimonda.com [phone]

81-3-5201-5083
82-31-208-6674 858-876-3042 0049/81 61/804874 519746-7374 408-621-4157 886-3-56781686665 408-750-1621

[e-mail]

sJoo@secsamsun .com [e-mail] g-rornbach©ti.com
d rast ©tyco ei e ottoni Cs- com

bitge©usmodular.com

Winbond Electronics Corp.

[e-mail]
sang han zmostechnology. com

Sang-Kyun Han

ZM0S Technology Inc

1_0

Introduction
The JC-45 Plenary meeting opened at 10:18AM on June 6, 2007. Mr. Quddus led the discussion of this group. Self-introductions were completed by the attendeet
The meeting introduction was read.

tIM

Patent Policy
The patent policy was reviewed.

Page Sof 55

GNET081753

Minutes of Meeting No. 15 JG-48 Module Committee

June 6-7 2006
1.2.0

Seattle. WA

Minutes
The minutes for the March 2007 meeting were reviewed and approved, with the modifications shown below, on a motion from Samsung and seconded by Netlist

Add approval to ballot 7280 DIMW bit extensions to SPID (Item #2161.00, section 2.4.4.0 of March '07 minutes). The addition to the minutes was requested by US Modular.
The motion passed by acclamation.
1.3.0

Meeting Rotation
Mr. Quddus announced that the meeting rotation for JC-45 would be as follows: 45.2,45.3, 45.4,45.5 then 45.1. (Note: the minutes record the sub-committees in normal sequence.)

1.4.0

Agenda
The agenda was reviewed and updated.

1.5.0

Awards
Chairman's Awards were given to Talcao Ono (Elpida), David Chan (Qimonda) and Joseph Tsang (Intel). Their contributions to recent standardization efforts were acknowledged recognized by applause by the committee.

1.6.0

Elections
Mr. Quddus indicated that the JC-45.2 (UDIMM) vice-chair has resigned, and requested nominations for this position from the floor: Nominations inciuded: -Yongshin Kim

Nominations were dosed due to no further nominations. Mr. Kim was eiected by acclamation.

Page 4of 55

GNE1081754

Minutes of Meetin9 No. 15

L-45 Module Committee
June 6-7. 2006
response. The motion passed with a vote count of S opposed and 6 ¡n favor.

Seattle. W

1.t2.0

#2065.17

HP

Total Module Power in DDR3 SPD

HP proposed the addition of two SPD bytes to the DORS SPD spec, to indicate 01MM power utilization: 1st byte: Minimum power utilization (idle condition) 2'' byte: Maximum power (max/worst case conditions)

An example was shown. HP indicated that two bytes may or may not be enough - prefer to have the TG consider the topic.
Discussion: - Concerns were raised in earlier discussions - may wish to consider delta power, etc.

1.9-3.0

#2151.01

Tyco

Folded Fin Heat Sink Cômparison Study for DIMM Applications

Tyco made an informational showing the committee. The presentation is intended to provide an introduction to folded fin technology, in addition to thermal studies and attachment methods.

A folded fin heat sink is a corrugated pattern of metal - example tooling was shown. A variety of folded fin heat sinks were shown as well as the folding design parameters, compressed/uncompressed versions, radial folded versions, etc. The thermal study objectives and conditions were shown, including various (air) bypass versions and other boundary cases. Model parameters were shówn for each case studied, as well as the wind tunnel environment. A mix of calculated and measured results was shown, showing the temperature rise as compared to the incoming air. Images were also shown for some heat sink configurations showing air velocity in and around the subject heat sinks. Attachment methods were summarized, including clips and 2-sided tape. Tape thermal resistance was covered. Work that still needs to be done was summarized, including shock and

Page 11 of55

GNETOB1761

Minutes of Meeting No. 15 JC-45 Module Committee
June 6-7. 2006
vibration testing.
Discussion: - in response to a request from the secretary, the Tyco representative indicated no known IP with the material shown.

Seattle. WA

1.9.4.0

#2003.11

Intel

FBDIMM1 Quad Rank SPO

Intel proposed a series of changes to accommodate quad rank FB DIMMs. The affected bytes were summarized, with changes identified on a per SPD byte basis. Bytes affected induded 7 (changed)1 75 78 (new bytes).

Intel indicated that this is a first showing of material, for consideration by the commiffee. #2065.18

1.9.5.0

US Modular

DDRS SPD Register Mfg ID

US Modular indicated that a request was made in March to add a register manufacturerl9eld in the DDR3 SPD. At this point, the manufacturer ID is optional in DDR3 SPD. The showing summarized what the proposed SPO information might look like, based on the DRAM ID field, 'ahiCh includes two bytes for inclusion in Registered DIMM SPDs.
Discussion: - May also need a DIMM manufacturer ID. -Why use bytes 63 and 64? Response: Location is not important, concept
is.

- Allows modules to be easily sorted when problems exist with register devices (rnfg test, field, etc). - Feel that the register specification should ensure functionality this should not be needed:

Motion by US Modular and seconded by Sun to elevate the material to a second showing. The motion failed with at least one company opposed. The topic will be discussed in the SPD 1G.

Page 12 of55

GNETDS1 762

Minutes of Meeting No. 15 JC-45 Module Committee
June 6-7. 2006
1.9-6.0

Seattle. WA 00R3 SPO Thermal Bytes

p2075.03 Intel

Intel proposed a series of three SPD bytes to accommodate the possible use of a thermal sensor, including: - Is a thermal sensor installed - Accuracy of sensor - F-teat spreader details (if installed) - S DRAM device type The SPO TG chairman indicated that this material should be considered as a second showing based on an earlier showing on similar material.

Motion by Intel and seconded by US Modular to empower the SPD 1G to issue one or more bytes on this material The motion passed by acclamation.

2.0

JC45.1 Registered DIMMs
The meeting opened at 9:30 AM on June 7,2007. Mr. Kiehl led the discussions of this group.

2.1.0

Agenda
The agenda was reviewed and updated.

2-2M

BoO Ballot Review
The following B0D ballots were previously returned to the committee due to unresolved IP concerns: - JCB-06-72 (#2119.01) - JCB-06-73 (#2119.02) - JCB-06-70 (#2129.01) No action taken on the above items at the outset of the meeting.
The committee returned to the above items upon completion oF the successful motion on related committee ballot JC-45. 1-07-154 (item #2119.03):

Motion by Staktek and seconded liS Modular to move item #2119.01 (JCB-

Page 13 of 55

GNETOB176S

0

'4

Minutes of Meøing No. 15 JC-45 Module Committee

June 67. 2006
5.5.0

Seattle. WA

First Presentations
#2171.01

5.5.1.0

Olmonda

4R X B FBDIMM (1Gb)

The maximum DRAM outline supported by the design is 9mm wide x 13 mm high. The planned design schedule was shown, which lagged the 512Mb design. Several layer plots were shown. This card is not based on an existing design - it is a new design.

5,5.2.0

#2171.02

Qimonda

4R X 4 FBDIMM Stack

The design supports 36 stacked dual die devices. The maximum DRAM outline is 13mm high x 9.1 mm wide. The card has 10 layers, with a stackup identical to R/C V (2Rx4). Blind via usage was summarized. The high speed routing is fundamentally idencal to R/C V - so no simulation of the high speed bus should be needed. The design schedule was also shown.
The addressing, command, control and DQ wiring was summarized. The component placements were shown, in addition to the net topologies and the routing layers.
Discussion: - Clarification questions were covered on the material shown. - Three raw cards were shown - Is Qimonda willing to allow other companies to sponsor any of the designs? Response: Can discuss in TG. - The DRAM size is quite small - are many DRAM devices expected, in the industry, that will meet this size (especially when stacked)? - In response to a question, Qimonda indicated no knowledge of IP associated with the designs. 5,5.3.0

#2171.03

Qinionda

4A xO FRDIMM (512 Mb)

The design is a 10 layer design, with a stack-up the same as RIC I-I. The maximum DRAM outline is 11 mm wide x 10.5mm high. The design uses blind vias and micro vias. Focus has been placed on power delivery, especially for the AME - key elements of the design were summarized. The design schedule was shown, with Rev 0.5 planned for August'07. A layout was shown, with rank distributions identified. The net topologies were also shown, as weil as the layer plots. Simulation plots were included, but not shown. The VCC resistance was shown, which is very close to the

Page 50 of 55

CN ETQB1 800

Minutes of Meeting No. 15 JC-45 Module Committee
June 6-7. 2006
existing specification.

Seattle. WA

5.5.4.0

#103.46

intel

AMB Quad Rank Support

An FYI showing was made using a L-40 item number.

Currentlythe AMB does notsupport4 rank DIMMs; however4 rank DIMMs are now being requested. With existing experience, it has been determined
that 4 rank DIMMS are possible1 given some changes to the AME.

The proposed changes will not affect existing systems - e.g. in regard to the architecture and protocol. The AMB pkg and pinout will also not change. The objective is to 'trick" the host into thinking that the DIMM is a 2-rank DIMM, using 2X device densities.
An extensive presentation was made, covering the fundamentals associated with the proposal. The quad rank signal requirements were summarized - with Cs, ODI, Address and CKE signals and/or functions being affected.

Tables were shown indicating the mapping of CS, ODT, CKE signals, with two ODT-based options shown. Newly assigned (re-assigned) signals (e.g. 0011 and ODT2) were identified. The means by which the different ranks were selected, using existing signals, was summarized. The additional address for each DRAM density increment was summarized, in conjunction with the means for providing that address. Intel noted that by enabling the use of Quad Rank DIMMs, the total number of DIMMs on a channel would be reduced (e.g. from 8FB DIMMs to 4 FE DIMMs max). The AMB control register implications/changes were also summarized.
Discussion: - In response to a question by the secretary, Mr. Tsang (Intel) indicated that IP filings are likely and he will pursue this information. He further indicated that he felt that Intel wouid likely be willing to meet the JEDEC RAND terms for any such IP,

6.0

JC4S.& Module Interconnect
The meeting opened at 8:55 AM on June 7,2007. Mr. McGrath led the

PageSl of 55

GNETO81BO1

Minutes of MeetIng No. 15 JC-45 Module Committee
June 6-7. 2006
discussions of this group.

Seattle,3JA

6.1.0

Agenda
No agenda was shown.

6.2.0

BolD Ballot Review
There were no SoD ballots for review in this sub-committee.

6.3.0

Ballot Review
There were no ballots for review in this sub committee.

6.4.0

Second Presentations
There wale no second presentations for this sub-committee.

6.5.0

First Presentations
#2170.00

6.5.1.0

Intel

Proposed Connector Specification for Outlines of Solid State and Related Components.

The connector outline was shown the committee needs to develop accurate modeling parameters and techniques. A table of proposed connector S-parameter requirements were shown, including insertion loss, return loss, far end crosstalkand near-end cross-talk. Proposed 'pass' criteria was shown, in addition to proposed measurement procedures.
An example of a frequency domain measurement was shown using a test board. Appendix A covered the proposed equipment, test fixtures and samples, etc.
Discussion: - Jc-45.5 is working with the Link Signaling TG (JC-16)to do channel modeling using the results of this Ta

Page 52 of 55

GNETOB18O2