Apple Inc. v. Samsung Electronics Co. Ltd. et al
Filing
1373
Unredacted Exhibits to Maharbiz Decl. ISO Apple's Opposition to Samsung's MSJ re 1256 Order on Administrative Motion to File Under Seal, (Dkt. No. 1013) by Apple Inc.. (Attachments: # 1 Exhibit D, # 2 Exhibit H, # 3 Exhibit J, # 4 Exhibit K, # 5 Exhibit L, # 6 Exhibit M, # 7 Exhibit N, # 8 Exhibit S)(Jacobs, Michael) (Filed on 7/26/2012) Modified text on 7/27/2012 (dhm, COURT STAFF).
Exhibit L
(Submitted Under Seal)
Doosung Choi
255 S. Grand Ave. Apt 1101
Los Angeles, CA 90012
(310) 850-2612
mchoi31@gmail.com
March 19, 2012
Certificate of Translation
I hereby certify that this Korean to English translation of pages
SAMNDCA10890091, SAMNDCA10890093, SAMNDCA10890094, SAMNDCA10890095,
and SAMNDCA10890097
of the document with the beginning Bates number SAMNDCA SAMNDCA10890091
is an accurate and complete rendering of the contents of the source document to the best of my
knowledge, except for the word “TRANSLATION” at the upper right corner of each translated
page. I further certify that I translated said document and that I am fluent in both Korean and
English.
BY:
TRANSLATION
Mobile Communications Division Future TSP Management Strategy
Platform Development Team
Visual Part
TRANSLATION
TSP Technology Trend
TSP Response Strategy
Global TSP Trends
R-Type Domniant Increase in Proportion of C-Type
(Superior optical properties and reliability)
Expansion
Centered
Around
C-Type
LCD
Companies’
Entrance
Becoming
Visible
On-Cell Touch
First commercialization in 2010
(10 % share in 2013)
TRANSLATION
TSP Response Strategy
Current Status of Competitors Using TSP
Competitor TSP Trends
Touch Phones are mainly released by X Company, A company, H Company and R Company.
N Company released only 2 models
N Company
A Company
X Company
Main Model
Main Model:
Main Model
Main Supplier: Nissha (Japan)
Main Supplier: TPK (Taiwan)
Wintek (China)
Main Supplier: Hitachi
ELK (Korea)
Currently, only released R-type TSP
products
C-type TSP model “X6” scheduled for
release Synaptics chip used
Acquired Finger Works business in
2006
Proceeding strategically with C-type
Using exclusive IC
In the future proceed with both C-type
and R-type in parallel
Continuing to use [TSP] ever since
iPhone 2G
Focused mainly on conventional R-type
TSP
Transition to C-type TSP in progress
: Emphasis on improved optical properties
Synaptics, Cypress, Melfas IC currently
used
TRANSLATION
TSP Response Strategy
Our Company TSP Progress Plan
Our Company TSP Basic Progress Plan
Continued expansion of volume of C-type TSP
C-type TSP Progress Direction: Achieve early and maintain performance superiority over competitors. (Proceed separately for Low/High-End)
Category
R-type TSP Progress Direction: Maintain superiority in performance over competitors – in terms of optical properties, thickness, strength, motion load
Continue with quality improvements
TRANSLATION
Our Company TSP Progress Plan
TSP Response Strategy
Our Company Technology Management Strategy
4Pi
Recognition Area: 8Pi
Response Speed:15ms
Power Consumption: 10mA
M
O
D
U
L
E
Upper Layer Bifurcation
FG Bifurcation
FG Trifurcation
Top & Bottom Panel Gap Enhancement
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